FACE Prep
Associate Business Analyst
Intel Corporation
IC Packaging Research and Development Engineer
Intel Corporation
Passives Project Program Manager
Apple Inc
Hardware Technology Engineering Program Manager
Zingerman's
Lean Consultant
Intel Corporation
Packaging Research and Development Intern
GBM
Intern
Reliance
Intern (Engineer)
Intel Corporation
Senior IC Packaging Research and Development Engineer
University of California, Berkeley, Haas School of Business
University of Michigan - Rackham Graduate School
University of Michigan
