Director, Packaging and Modeling Group, Technology and Manufacturing Group
California
Maxim Integrated
Director, Packaging and Modeling Group, Technology and Manufacturing Group
Intel Corporation
Design Program Manager, 22nm Server Cpu Packages
Intel Corporation
Package Thermal Engineer
Intel Corporation
Design Project Manager
Apple Inc
Sip DFM Manager
Skyworks Solutions, Inc.
Engineering Manager, Advanced Mobile Solutions
Maxim Integrated
Senior Manager
Intel Corporation
Program Manager and Pathfinding Integrator
University of Maryland
University of Minnesota
Indian Institute of Technology, Madras
