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Sooyong Kim

Director, Product Specialist and Product Management in 3DIC Chip Package Systems and Multiphysics

Guilderland, NY

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Work:
Employment History of Sooyong Kim

ANSYS, Inc.

Director, Product Specialist and Product Management in 3DIC Chip Package Systems and Multiphysics

Cadence Design Systems

Sales Technical Leader

Samsung Electronics

Director, 3D IC and Packaging

Schools:
Schools Attended by Sooyong Kim

Rensselaer Polytechnic Institute

Related:
Others that have worked at the same companies
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Jacob Gantz
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Kwangsik Kim
Commercial Sales Manager at ansys.com