Rory Buszka

Engineering Intern

Work:
Employment History of Rory Buszka

Brad Foote Gearing

Engineering Intern


HARMAN International

Transducer Engineer


Alpine Electronics of America, Inc.

Technology Planning Engineer


Parts Express

Product Manager - Dayton Audio


Matrix Technologies, Inc.

Project Engineering Intern


Alpine Electronics of America, Inc.

Acoustic Engineer - Transducers and Enclosures


Thiel Audio

Mechanical Engineer


Butler Aerospace & Defense

Airframe Design Engineer


Alpine Electronics of America, Inc.

Sales Engineer


Emotiva Audio

Electromechanical Engineer

Schools:
Schools Attended by Rory Buszka

Purdue University


Westfield High School

Related:
Others that have worked at the same companies
Director, Automotive Partnerships at alpine-usa.com


Lead Designer at alpine-usa.com