Principal Hardware Engineer, Semiconductor Packaging and PCB Technologies
Santa Clara, CA
Sun Microsystems
Principal Hardware Engineer, Semiconductor Packaging and PCB Technologies
Adeia
Sr. Director, 3D Technology Simulation and Analytics
Xperi Inc.
Director, Thermal Mechanical Packaging Design and Analysis
Nubis Communications
Sr. Director of Engineering
Quanergy Solutions Inc.
Sr. Director, Semiconductor Packaging and NPI
Molex
Director Of Mechanical Engineering, Oplink Optical Solutions Group
Kaiam Corporation
Director of Advanced Packaging
Intel Corporation
Principal Engineer, Silicon Photonics and Programmable Solutions
University of Michigan
