Lab Manager-Advanced Packaging, Fab and Processes
Schenectady, New York
GE Global Research
Lab Manager-Advanced Packaging, Fab and Processes
IBM
Staff Engineer
Infotonics Technology Center
Director of MEMS and Microsystems Packaging
Infotonics Technology Center
Director of Microsystems Packaging
GE Global Research
Horizontal Leader-Flexible Hybrid Electronics
GE Global Research
Sr Engineer in Electronic Packaging; Quality Leader for Specialty Electronics Manufacturing
Xerox
Development Manager and Principal Scientist
IEEE
IEEE ECTC Executive Committee- 2021 General Chair
Columbia University in the City of New York
University of Virginia
Cornell University
