Senior Process Engineer | Epoxy Die Bond (QFP and BGA) | RFiD Pioneers for FOL
NXP acquires Freescale Semiconductor
Senior Process Engineer | Epoxy Die Bond (QFP and BGA) | RFiD Pioneers for FOL
Infineon Technologies
Staff Engineer (UPD) | Soft Solder Writing Die Attach and Clip Attach | Cu Clip Power Package
STMicroelectronics
Process Engineer | Flip Chip Die Attach (BGA)
Malakoff Corporation Berhad
Practical Engineer | Coal Handling Power Plant
NXP Semiconductors
Principal Engineer Process Integration
Sekolah Menengah Teknik Muar
Universiti Teknologi MARA
