Principal Staff Engineer, MEMS Sensors Product Division
Motor X
Principal Staff Engineer, MEMS Sensors Product Division
Intel Corporation
Senior Technical Lead, Mobility Group, Package Technologies Development
Intel Corporation
Principal Engineer and Technical Director, Technology Manufacturing Group, Packaging TD Reliability
TDK
Vice President, MEMS Packaging Technology Development
Intel Corporation
Sr. Technology Development Manager, Technology and Manufacturing Group, Packaging TD
TDK
Senior Director, Head of MEMS Packaging Technology Development
University of Montenegro
University of Belgrade
Arizona State University
