Qualcomm
Senior Engineer
HCL America, Inc.
Analog Design Engineer
Institute of Lightweight Engineering and Polymer Technology (ILK). Technische Universität Dresden
Project Work
Racyics
Intern - Analog Design
Institute of Lightweight Engineering and Polymer Technology (ILK). Technische Universität Dresden
Master's Thesis
Dr. B.C. Roy Engineering College
Technische Universität Dresden
