Technology Development Quality and Reliability Engineer - Transistor Lead for 32nm SoC Process Node
hillsboro, oregon, united states
Intel Corporation
Technology Development Quality and Reliability Engineer - Transistor Lead for 32nm SoC Process Node
International Reliability Physics Symposium
Session Co-chair, IRPS 2020, Process Integration Technical Session
Intel Corporation
Technology Development Quality and Reliability Engineer - Intel's 65nm Chipset Process Nodes
Intel Corporation
Senior Technical Leader Driving Business Critical Strategic Reliability Projects at Intel
Intel Corporation
Intel's 10nm CMOS Technology Pathfinding Lead - Transistor Reliability Solutions for CPU Products
International Reliability Physics Symposium
Chair Emeritus, IRPS 2022, Process Integration Reliability Session
Intel Corporation
Technology Development Quality and Reliability Engineer - Transistor Lead 22nm SoC-RF Process Node
Intel Corporation
Intel's 10nm CMOS Technology Development Lead - Transistor Reliability Solutions for CPU Products
Intel Corporation
Senior Technical Leader Driving Strategic Reliability Solutions at Intel
International Reliability Physics Symposium
Session Chair, IRPS 2021, Process Integration Reliability Session
Bangladesh University of Engineering and Technology
Purdue University